Research Activities at
Stanford TCAD group, Integrated Circuits Laboratory of Stanford University SUN Microsystems, Inc. Synopsys Inc. Rambus, Inc.
- Compact Wire Models and Power Integrity for High Speed I/O Interfaces
- Leakage Current Optimization and Circuit Reliability Modeling
- Impact of Process Variations on VLSI Interconnects, Device and Circuit Performance
- On-Chip Inductance Modeling of VLSI Interconnects Including Power/Ground Grids
- On-Chip Inductance Modeling and RLC Extraction of VLSI Interconnects for Circuit Simulation
- A Fast 3-D Modeling Approach to Parasitics Extraction of Package/Bonding Wires for RF Circuits
- Layout-based 3-D Solid Modeling of IC Structures and Interconnects Including Electrical Parameter Extraction
- Other Projects
Ph.D. Thesis:
High Frequency Characterization and Modeling of On-Chip Interconnects and RF IC Wire Bonds
Advisor: Professor Robert W. Dutton
My oral thesis defence abstract.pdf and presentation.pdf on October 6, 2000.
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