A Fast 3-D Modeling Approach to Parasitics Extraction of Bonding Wires
for RF Circuits
(cooperated with
Ericsson)
A fast 3-D modeling method is developed which captures the
geometry of bonding wires from SEM photos and the electrical parameters
are extracted based on the geometry. Test structures have been fabricated
and measured. Simulation results are in excellent agreement with the
measured data.
A paper was presented at 1998 IEEE International Electron
Devices Meeting (IEDM'98, Dec. 1998). The complete work was published in
IEEE Transactions on Advanced Packaging, Aug., 2000.
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