Research Issues/Challenges
Demonstration of alternative material(s) for RF MEMS (c2):
There is a very exciting set of candidates with application-pull from other DoD contracts at Stanford. Testarosa (test array) is being used to evaluate. Promise of this task really offers “breakthrough” potential (and proof-of-concept for “Round Robin”)
Development of fatigue model in support of MEMS analysis (f1):
The demonstration of microstructure features of Aluminum during cyclic failure opens exciting new avenues to link into the FEM-based multi-physics simulations. Challenges are two-fold: 1) creating the model, 2) moving beyond Al as metal
Software integration for Demo (d1)--wrappers (interface definition) that supports interoperability:
Details in the choices (and trade-offs) for passing pure geometry versus gridded structures (that implicitly contain geometry) is the key point that needs to be evaluated