Stanford Canonical Design Problem Process Definition Specification

By: Edward Chan, Stanford University
Date:  June 7, 1999

Adaptation of Composite CAD Process Definition Specification v1.0 for 50kHz
example found on Composite CAD Extranet.

NOTE:
Adjusted thicknesses to measurements
Removed POLY2 layer from process spec
N.B.: Effect of gold (different thicknesses for the same layer) cannot
  be defined in this spec
---------------------------------------------------------------------------                      


ProcessVersion={
	Version=1.0beta
}
ProcessUnit={
	Unit=microns
}
Wafer={
MaskName="substrate"
Thickness=100
Comment="Wafer"
}
Deposit={
DepositType=CONFORMAL
Face=TOP
LayerName="Nitride"
Thickness=.6
Scf=c
Comment="Deposit Nitride"
}
Deposit={
DepositType=CONFORMAL
Face=TOP
LayerName="Poly0"
Thickness=.53
Scf=0.9
Comment="Deposit Poly0"
}
Etch={
	EtchType=SURFACE
Face=TOP
MaskName="Poly0"
EtchMask=OUTSIDE
Depth=0.53
Angle=90
Undercut=0
EtchRemoves="Poly0"
Comment="Etch Poly0"
}
Deposit={
DepositType=CONFORMAL
Face=TOP
LayerName="Ox1"
Thickness=2.16
Scf=.5
Comment="Deposit Ox1"
}
Etch={
	EtchType=SURFACE
Face=TOP
MaskName="Dimple"
EtchMask=INSIDE
Depth=.76
Angle=79
Undercut=0
EtchRemoves="Ox1"
Comment="Etch Dimple"
}
Etch={
	EtchType=SURFACE
WaferID=w1
Face=TOP
MaskName="Anchor1"
	EtchMask=INSIDE
Depth=2.16
Angle=79
Undercut=0
EtchRemoves="Ox1"
Comment="Etch Anchor1"
}
Deposit={
DepositType=CONFORMAL
Face=TOP
LayerName="Poly1"
Thickness=1.99
Scf=0.9
Comment="Deposit Poly1"
}
Etch={
	EtchType=SURFACE
Face=TOP
MaskName="Poly1"
EtchMask=OUTSIDE
Depth=1.99
Angle=90
Undercut=0
EtchRemoves="Poly1"
EtchRemoves="Poly0"
Comment="Etch Poly1"
}
Deposit={
DepositType=SNOWFALL
Face=TOP
LayerName="Metal"
Thickness=.5
}
Etch={
	EtchType=SURFACE
WaferID=w1
Face=TOP
MaskName="Metal"
EtchMask=OUTSIDE
Depth=.52
Angle=90
Undercut=0
EtchRemoves="Metal"
Comment="Metal Liftoff"
}
SacrificialEtch={
	EtchType=SACRIFICIAL
Face=TOP
EtchRemoves="Ox1"
EtchRemoves="Ox2"
Comment="Sacrificial Etch"
}