Object-Oriented Information Models for Next-Generation TCAD
Simulators
Currently under development are object-oriented information models for
next-generation TCAD simulators. These models allow representation
and manipulation of three-dimensional data, and are applying these
capabilities primarily to 3D semiconductor wafer information. Through
the use of these modeling techniques, construction of 3D
geometrical representations of wafers and associated structures such
as interconnects and oxide layers are possible. Also these
geometries are used as the basis for device and circuit simulation through the
use of two and three dimensional meshing tools.
Ken Wang is working on the development of an application which is based on
the 3D graphical tools we have built. This application demonstrates
the ability to generate highly realistic 3D structures in an
integrated, intuitive fashion. Current work involves the expansion of
geometrical operations which are available to the user. These will
further improve the realism of the resulting structures and the ease
with which they are created.
Ken Wang(wang@gloworm.Stanford.EDU)
AEL 229
Integrated Circuits Laboratory
Stanford University
Stanford, CA 94305-4055