Zhiping Yu graduated from Tsinghua University, Beijing, China, in 1967 with B.S.-equivalent degree. He received his M.S. and Ph. D degrees from Stanford University, Stanford, CA, U.S.A. in 1980, and 1985, respectively.
He is presently a Senior Research Associate at Dept. of Electrical Engineering in Stanford University, and also holds a faculty position in Tsinghua University. From 1981 to 1985, he was a Research Assistant in the Dept. of Electrical Engineering, Stanford University; at the same time he worked as a consultant in device modeling and simulation for silicon valley companies such as HP and Intel Corp. From 1985 to early 1986, he was a postdoctor at Stanford and also conducted research in SGS Microelectronica, Agrate, Milan, Italy. During 1986 to 1989 he was one of the chief architects in a national project of developing a complete IC CAD design system (PANDA) in China. His research interests focus on IC process, device, and circuit simulation, and in particular, the numerical techniques and modeling of devices with heterostructures. Recently, he has been involved in efforts to develop a simulation package for optoelectronic devices and 3D solid modeling for ICs. He is also a consultant to Hewlett-Packard Corp.
He has published more than sixty technical papers and is the co-author with Prof. R. W. Dutton of a book titled ``Technology CAD -- Computer Simulation of IC Processes and Devices'' by Kluwer Academic Publishers.
Dr. Yu is a senior member of IEEE and Associate Editor of IEEE Trans. CAD of IC & Systems.
Zhiping Yu (yu@gloworm.Stanford.EDU)