Publications by Kai Hsiau

• Robust, Stable and Accurate Boundary Movement for Physical Etching and Deposition Simulation --submitted for publication

Z. K. Hsiau, E. C. Kan, J. P. McVittie and R. W. Dutton

• 2D/3D Etching and Deposition Simulation Tools Implemented with a General TCAD Geometry Server compressed file --TECHCON 96

Z. K. Hsiau, E. C. Kan, J. P. McVittie and R. W. Dutton

• Modeling and Characterization of Three-Dimensional Effects in Physical Etching and Deposition Simulation --SISPAD 96
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Z. K. Hsiau, E. C. Kan, D. S. Bang, J. P. McVittie and R. W. Dutton

• Physical Etching and Deposition Simulation with Collision Free Coundary Movement (compressed file)--IEDM 95

Z. K. Hsiau, E. C. Kan, J. P. McVittie and R. W. Dutton

• Heterogeneous Process Simulation Tool Integration --IEEE Transactions on Semiconductor Manufacturing Science, vol. 9(1), pp. 35-48, Feb., 1996

Z. Sahul, K. Wang, Z. K. Hsiau, E. McKenna and R. W. Dutton

• Modeling of Tungsten Etchback for Vias and Contact Plugs throught FOREST and SPEEDIE --V-MIC 94

Z. K. Hsiau, E. C. Kan, J. P. McVittie and R. W. Dutton

• Ion Heating in the Pre-sheath of a Capacitively Coupled RF Discharge --Electrochemical Society 94

R. Brinkmann, Z. K. Hsiau, J. Zheng and J. P. McVittie

• Multistep Etching/Deposition Profile Simulation Using SPEEDIE --TECHCON 93

Z. K. Hsiau and J. P. McVittie