SISPAD '97 Author's Guide

Manuscript Deadline: June 6, 1997

Congratulations on the acceptance of your paper to the International Conference on Semiconductor Processes and Devices: SISPAD '97!

• Guide to preparing your SISPAD '97 manuscript:
  • In postscript format
  • In LaTex format (courtesy of IEEE): prepguid.html and IEEEmagn.sty

• IEEE Copyright Form. Please send in along with your manuscript.

• Should you decide to order extra copies of your paper, please fill out the IEEE Reprint Form.

Your manuscript should not exceed four pages and must meet the format standards. One copy of the manuscript and copyright form should be sent to the following address:

Fely Barrera (SISPAD '97)
Stanford University
CISX 332, M/C 4075
Stanford, CA 94305-4075

You are also encouraged to submit a full paper for inclusion in a special issue of the IEEE Journal of Technology Computer-Aided Design. This journal is all electronic, and can be found on the WWW at the http://engine.ieee.org/journal/tcad. Instructions for authors can also be found at this Web site. Full papers for the special issue will be due November 15, 1997. Papers submitted will undergo a regular review process and publications is not guaranteed.

Invited Papers (only):

Please send your abstract electronically for inclusion in the Advance Program. Thank you!

Name:
Abstract: